Part Number Hot Search : 
PINF15 FMS00 JANSR HMC48 D1612BSI 0SPBF M2002 UF4007
Product Description
Full Text Search
 

To Download S93662 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
  summit microelectronics, inc. ? 300 orchard city drive, suite 131  campbell, ca 95008  telephone 408-378- 6461  fax 408-378-6586  www.summitmicro.com 1 S93662/s93663 ? summit microelectronics, inc. 2000 2012 2.1 8/2/00 characteristics subject to change without notice precision supply-voltage monitor and reset controller summit microelectronics, inc. features ? precision monitor & reset controller ? reset and reset outputs ? guaranteed reset assertion to v cc = 1v ? 200ms reset pulse width ? internal 1.26v reference with 1% accuracy ? zero external components required  memory ? 4k-bit microwire memory ? S93662 ? internally ties org low ? 100% compatible with all 8-bit implementations ? sixteen byte page write capability ? s93663 ? internally ties org high ? 100% compatible with all 16-bit implementations ? eight word page write capability overview the S93662 and s93663 are precision power supervi- sory circuits providing both active high and active low reset outputs. both devices have 4k-bits of e 2 prom memory that is accessible via the industry standard microwire bus. the S93662 is configured with an internal org pin tied low providing a 8-bit byte organization and the s93663 is configured with an internal org pin tied high providing a 16-bit word organization. both the S93662 and s93663 have page write capability. the devices are designed for a minimum 100,000 program/erase cycles and have data retention in excess of 100 years. block diagram + ? gnd v cc 8 5 reset# 6 v trip reset pulse generator 5khz oscillator reset control mode decode address decoder write control data i/o e 2 prom memory array reset 7 1.26v sk 2 di 3 cs 1 2012 t bd 2.0 do 4
2 S93662/s93663 2012 2.1 8/2/00 pin functions pin name function cs chip select sk clock input di serial data input do serial data output v cc +2.7 to 6.0v power supply gnd ground reset/reset# reset i/o pin configuration device operation applications the S93662/663 is ideal for applications requiring low voltage and low power consumption. this device pro- vides microcontroller reset control and can be manu- ally resettable. reset controller description the S93662/663 provides a precision reset controller that ensures correct system operation during brownout and power-up/-down conditions. it is configured with two open drain reset outputs; pin 7 is an active high output and pin 6 is an active low output. during power-up, the reset outputs remain active until v cc reaches the v trip threshold. the outputs will con- tinue to be driven for approximately 200ms after reach- ing v trip . the reset outputs will be valid so long as v cc is
3 S93662/s93663 2012 2.1 8/2/00 read upon receiving a read command and an address (clocked into the di pin), the do pin of the S93662/663 will come out of the high impedance state and, will first output an initial dummy zero bit, then begin shifting out the data addressed (msb first). the output data bits will toggle on the rising edge of the sk clock and are stable after the specified time delay (t pd0 or t pd1 ). write after receiving a write command, address and the data, the cs (chip select) pin must be deselected for a minimum of 250ns (t csmin ). the falling edge of cs will start automatic erase and write cycle to the memory location specified in the instruction. the ready/busy status of the S93662/663 can be determined by select- ing the device and polling the do pin. erase upon receiving an erase command and address, the cs (chip select) pin must be deselected for a minimum of 250ns (t csmin ). the falling edge of cs will start the auto erase cycle of the selected memory location. the ready/busy status of the S93662/663 can be deter- mined by selecting the device and polling the do pin. once cleared, the content of a cleared location returns to a logical ? 1 ? state. erase/write enable and disable the S93662/663 powers up in the write disable state. any writing after power-up or after an ewds (write disable) instruction must first be preceded by the ewen (write enable) instruction. once the write instruction is enabled, it will remain enabled until power to the device is removed, or the ewds instruction is sent. the ewds instruction can be used to disable all S93662/663 write and clear instructions, and will prevent any accidental figure 1. sychronous data timing figure 2. read instruction timing sk 2012 ill 3 1.0 di cs do t dis t pd0, t pd1 t csmin t css t dis t dih t skhi t csh valid valid data v alid t sklow sk 2012 ill4 1.0 cs di do t cs standby t hz high-z high-z 11 0 a n a n ? 1 a 0 0 d n d n ? 1 d 1 d 0 t pd0
4 S93662/s93663 2012 2.1 8/2/00 writing or clearing of the device. data can be read normally from the device regardless of the write enable/ disable status. erase all upon receiving an eral command, the cs (chip select) pin must be deselected for a minimum of 250ns (t csmin ). the falling edge of cs will start the self clocking clear cycle of all memory locations in the device. the clocking of the sk pin is not necessary after the device has entered the self clocking mode. the ready/busy status of the S93662/663 can be determined by select- ing the device and polling the do pin. once cleared, the contents of all memory bits return to a logical ? 1 ? state. write all upon receiving a wral command and data, the cs (chip select) pin must be deselected for a minimum of 250ns (t csmin ). the falling edge of cs will start the self clocking data write to all memory locations in the device. the clocking of the sk pin is not necessary after the device has entered the self clocking mode. the ready/ busy status of the S93662/663 can be determined by selecting the device and polling the do pin. it is not necessary for all memory locations to be cleared before the wral command is executed. page write 93662 - assume wen has been issued. the host will then take cs high, and begin clocking in the start bit, write command and 9-bit byte address immediately followed by the first byte of data to be written. the host can then continue clocking in 8-bit bytes of data with each byte to be written to the next higher address. internally the address pointer is incremented after receiving each group of eight clocks; however, once the address counter reaches x xxxx 1111 it will roll over to x xxxx 0000 with the next clock. after the last bit is clocked in no internal write operation will occur until cs is brought low. 93663 - assume wen has been issued. the host will then take cs high, and begin clocking in the start bit, write command and 8-bit byte address immediately followed by the first 16-bit word of data to be written. the host can then continue clocking in 16-bit words of data with each word to be written to the next higher address. internally the address pointer is incremented after receiving each group of sixteen clocks; however, once the address counter reaches xxxx x111 it will roll over to xxxx x000 with the next clock. after the last bit is clocked in no internal write operation will occur until cs is brought low. continuous read this begins just like a standard read with the host issuing a read instruction and clocking out the data byte [word]. if the host then keeps cs high and continues generating clocks on sk, the S93662/663 will output data from the next higher address location. the S93662/663 will continue incrementing the ad- dress and outputting data so long as cs stays high. if the highest address is reached, the address counter will roll over to address 0000. . cs going low will reset the instruction register and any subsequent read must be initiated in the normal manner of issuing the com- mand and address.
5 S93662/s93663 2012 2.1 8/2/00 figure 3. write instruction timing figure 4. erase instruction timing figure 5. ewen/ewds instruction timing sk 2012 ill 5 1.0 cs di do t cs standby high-z high-z 101 a n a n-1 a 0 d n d 0 busy ready status verify t sv t hz t ew sk 2012 ill6 1.0 cs di do standby high-z high-z 1 a n a n-1 busy ready status verify t sv t hz t ew t cs 11 a 0 sk 2012 ill 7 1.0 cs di standby 10 0 * * enable=1 1 disable=00
6 S93662/s93663 2012 2.1 8/2/00 figure 7. wral instruction timing instruction set instruction start opcode address data comments bit x8 x16 x8 x16 read 1 10 a8 ? a0 a7 ? a0 read address an ? a0 erase 1 11 a8 ? a0 a7 ? a0 clear address an ? a0 write 1 01 a8 ? a0 a7 ? a0 d7 ? d0 d15 ? d0 write address an ? a0 ewen 1 00 11xxx xxxx 11xxx xxx write enable ewds 1 00 00xxx xxxx 00xxx xxx write disable eral 1 00 10xxx xxxx 10xxx xxx clear all addresses wral 1 00 01xxx xxxx 01xxx xxx d7 ? d0 d15 ? d0 write all addresses 2012 pgm t5 1.1 sk 2012 ill 10 1.0 cs di do t cs high-z 10 1 busy ready status verify t sv t hz t ew 0 0 standby d o d n figure 6. eral instruction timing sk 2012 ill 8 1.0 cs di do t cs high-z high-z 10 1 busy ready status verify t sv t hz t ew 00 standby
7 S93662/s93663 2012 2.1 8/2/00 absolute maximum ratings* temperature under bias ......................................................................................................... ........................... ? 55 c to +125 c storage temperature ............................................................................................................ ............................. ? 65 c to +150 c voltage on any pin with respect to ground (1) ............................................................................................ ? 2.0v to +v cc +2.0v v cc with respect to ground ........................................................................................................ .......................... ? 2.0v to +7.0v package power dissipation capability (ta = 25 c) ............................................................................................................. 1.0w lead soldering temperature (10 seconds) ........................................................................................ ................................ 300 c output short circuit current (2) ............................................................................................................................... ............ 100ma *comment stresses above those listed under ? absolute maximum ratings ? may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this specificat ion is not implied. exposure to any absolute maximum rating for extended periods may affect device performance and reliability. note: (1) the minimum dc input voltage is ? 0.5v. during transitions, inputs may undershoot to ? 2.0v for periods of less than 20ns. maximum dc voltage on output pins is v cc +0.5v, which may overshoot to v cc +2.0v for periods of less than 20ns. (2) output shorted for no more than one second. no more than one output shorted at a time. (3) this parameter is tested initially and after a design or process change that affects the parameter. (4) latch-up protection is provided for stresses up to 100ma on address and data pins from ? 1v to v cc +1v. d.c. operating characteristics (over recommended operating conditions unless otherwise specified) limits symbol parameter min. typ. max. units test conditions i cc power supply current 3 ma di = 0.0v, f sk = 1mhz (operating) v cc = 5.0v, cs = 5.0v, output open i sb power supply current 50 a cs = 0v (standby) reset outputs open i li input leakage current 2 a v in = 0v to v cc i lo output leakage current 10 a v out = 0v to v cc , (including org pin) cs = 0v v il1 input low voltage -0.1 0.8 v 4.5v-v cc <5.5v v ih1 input high voltage 2 v cc +1 v v il2 input low voltage 0 v cc  0.2 v 1.8v-v cc <2.7v v ih2 input high voltage v cc  0.7 v cc +1 v v ol1 output low voltage 0.4 v 4.5v-v cc <5.5v v oh1 output high voltage 2.4 v i ol = 2.1ma i oh = -400a v ol2 output low voltage 0.2 v 1.8v-v cc <2.7v v oh2 output high voltage v cc -0.2 v i ol = 1ma i oh = -100a 2012 pgm t3 1.1 reliability characteristics symbol parameter min. max. units reference test method n end (3) endurance 100,000 cycles/byte mil-std-883, test method 1033 t dr (3) data retention 100 years mil-std-883, test method 1008 v zap (3) esd susceptibility 2000 volts mil-std-883, test method 3015 i lth (3)(4) latch-up 100 ma jedec standard 17 2012 pgm t2 1.1 temperature min max commercial 0 c +70 c industrial -40 c +85 c recommended operating conditions 2012 pgm t7 1.0
8 S93662/s93663 2012 2.1 8/2/00 limits v cc =2.7v-4.5v v cc =4.5v-5.5v test symbol parameter min. max. min. max. units conditions t css cs setup time 100 50 ns t csh cs hold time 0 0 ns v il = 0.45v t dis di setup time 200 100 ns v ih = 2.4v t dih di hold time 200 100 ns c l = 100pf t pd1 output delay to 1 0.5 0.25 s v ol = 0.8v t pd0 output delay to 0 0.5 0.25 s v oh = 2.0v t hz (1) output delay to high-z 200 100 ns t ew program/erase pulse width 10 10 ms t csmin minimum cs low time 0.5 0.25 s t skhi minimum sk high time 0.5 0.25 s t sklow minimum sk low time 0.5 0.25 s t sv output delay to status valid 0.5 0.25 s c l = 100pf sk max maximum clock frequency dc 500 dc 1000 khz note: (1) this parameter is tested initially and after a design or process change that affects the parameter. note: (1) this parameter is tested initially and after a design or process change that affects the parameter. a.c. characteristics (over recommended operating conditions unless otherwise specified) c l = 100pf 2012 pgm t6 1.0 pin capacitance symbol test max. units conditions c out (1) output capacitance (do) 5 pf v out =ov c in (1) input capacitance (cs, sk, di, org) 5 pf v in =ov 2012 pgm t4 1.0
9 S93662/s93663 2012 2.1 8/2/00 figure 8. reset timing diagram reset circuit ac and dc electrical characteristics 2.7 5 volt-a 5 volt-b symbol parameter min max min max min max unit v trip reset trip point 2.55 2.7 4.25 4.5 4.50 4.75 v t purst power-up reset timeout 130 270 130 270 130 270 ms t rpd v trip to reset output delay 5 5 5 s v rvalid reset# output valid 1 1 1 v t glitch glitch reject pulse width 30 30 30 ns v olrs reset# output low voltage i ol =1ma 0.4 0.4 0.4 v v ohrs reset output high i oh v cc -.75 v cc -.75 v cc -.75 v 2012 pgm t1 1.1 v cc v rvalid v trip t purst reset# reset 2012 t fig08 2.0 t glitch t rpd t purst t rpd
1 0 S93662/s93663 2012 2.1 8/2/00 .228 (5.80) .244 (6.20) .016 (.40) .035 (.90) .020 (.50) .010 (.25) x45 .0192 (.49) .0138 (.35) .061 (1.75) .053 (1.35) .0098 (.25) .004 (.127) .05 (1.27) typ. .275 (6.99) typ. .030 (.762) typ. 8 places .050 (1.27) typ. .050 (1.270) typ. 8 places .157 (4.00) .150 (3.80) .196 (5.00) 1 .189 (4.80) footprint 8pn jedec soic ill.2 8 pin soic (type s) package jedec (150 mil body width)
11 S93662/s93663 2012 2.1 8/2/00 frequently the reset controller will be deployed on a pc board that provides a peripheral function to a system. examples might be modem or network cards in a pc or a pcmcia card in a laptop. in instances like this the peripheral card may have a requirement for a clean reset function to insure proper operation. the system may or may not provide a reset pulse of sufficient duration to clear the peripheral or to protect data stored in a nonvolatile memory. the i/o capability of the reset pins can provide a solution. the system ? s reset signal to the peripheral can be fed into the S93662/663 and it in turn can clean up the signal and provide a known entity to the peripheral ? s circuits. the figure below shows the basic timing characteristics under the assumption the reset input is shorter in duration than t purst . the same reset output affect can be attained by using the active high reset input. when planning your resistor pull-up and pull-down values, use the following chart to help determine min. resistances. condition min typ max units v cc = 1.0v, i ol =100a 0.3 v v cc = 1.2v, i ol =100a 0.3 v v cc = 3.0v, i ol =500a 0.3 v v cc = 3.6v, i ol =500a 0.3 v v cc = 4.5v, i ol =750a 0.3 v v cc = 1.0v, i ol =100a 0.4 v v cc = 1.2v, i ol =150a 0.4 v v cc = 3.0v, i ol =750a 0.4 v v cc = 3.6v, i ol =1ma 0.4 v v cc = 4.5v, i ol =1ma 0.4 v v cc = 1.0v, i oh =400a v cc -0.75 v v cc = 1.2v, i oh =800a v cc -0.75 v v cc = 3.0v, i oh =800a v cc -0.5 v v cc = 3.6v, i oh =800a v cc -0.5 v v cc = 4.5v, i oh =800a v cc -0.5 v worst case reset sink/source capabilities at various v cc levels parameter symbol reset# output v ol voltage reset# output v ol voltage reset output v oh voltage 2012 pgm t5 1.0 reset# input reset# output reset output 2012 t fig09 2.0 t purst
12 S93662/s93663 2012 2.1 8/2/00 ready/busy status during the internal write operation the S93662/663 memory array is inaccessible. after starting the write operation (taking cs low) the host can implement a 10ms time-out routine or alternatively it can employ a polling routine that tests the state of the do pin. after starting the write, testing for the status is easily accomplished by taking cs high and testing the state of do. if it is low the device is still busy with the internal write. if it is high the write operation has completed. for the polling routine the host has the option of toggling cs for each test of do, or it can place cs high and then intermittently test do. sk is not required for any of these operations. once the device is ready, it will continue to drive do high whenever the S93662/663 is selected. the ready state of do can be cleared by clocking in a start bit; this start bit can either be the beginning of a new command sequence or it can be a dummy start bit with cs returning low before the host issues a new command. sk 2012 ill 13 1.0 cs di do t cs high-z high-z status cleared busy ready status verify t sv t hz t ew
13 S93662/s93663 2012 2.1 8/2/00 ordering information blank = tube t = tape & reel a = 4.5v to 5.5v v trip min. @ 4.25v b = 4.5v to 5.5v v trip min. @ 4.50v 2.7 = 2.7v to 5.5v v trip min. @ 2.55v S93662 s a t base part number package s = 8 lead 150mil soic S93662 = 8-bit configuration s93663 = 16-bit configuration tape & reel option operating voltage range 2012 tree 2.0
14 S93662/s93663 2012 2.1 8/2/00 notice summit microelectronics, inc. reserves the right to make changes to the products contained in this publication in order to improve design, performance or reliability. summit microelectronics, inc. assumes no responsibility for the use of any circuits described herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent infringement. charts and schedules contained herein reflect representative operating parameters, and may vary depending upon a user ? s specific application. while the information in this publication has been carefully checked, summit microelectronics, inc. shall not be liable for any damages arising as a result of any error or omission. summit microelectronics, inc. does not recommend the use of any of its products in life support or aviation applications where the failure or malfunction of the product can reasonably be expected to cause any failure of either system or to significantly affect their safety or effectiveness. products are not authorized for use in such applications unless summit microelectronics, inc. receives written assurances, to its satisfaction, that: (a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; and (c) potential liability of summit microelectronics, inc. is adequately protected under the circumstances. ? copyright 2000 summit microelectronics, inc.


▲Up To Search▲   

 
Price & Availability of S93662

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X